DISCO precision machines dicing-grinding service

Best Equipment for advanced Dicing-Grinding Service. DISCO’s high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.

Ultra-Thin Grinding Grinding Solutions DISCO Corporation

Photo 1 shows a Φ300 mm silicon wafer reduced to 5 µm thickness by grinding only. By optimizing the equipment, wheels, and grinding conditions introduced here, such thinness can be achieved using normal grinding only. Photo 1: t5 µm, Φ300 mm Silicon Wafer(Supplied by Renesas Technology Corp) Equipment

Grinding Solutions DISCO Corporation

Ultra-Thin Grinding In recent years, the demand for ultra-thin die for use in mobile phones, stacked packages, and a myriad of other applications has been increasing. DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions.

共通 DISCO Corporation

Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipment.Investor relations, careers, and DISCO corporate information is also

Product Information DISCO Corporation

Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.

Dicing and Grinding Using the Disco Corporation

Process Workflow 1: Processing by Each Equipment (Stand-Alone) (Each step is performed by stand-alone equipment) Protective tape (BG tape for backside grinding) is laminated onto the wafer surface’s circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the wafer surface.

Thinning by Grinding Wheel (Grinding)| DISCO Technology

Overview of Thinning by Grinding Wheel. Grinding is a process for making board-shaped workpieces thin (approx. less than 1 mm thick) and flat by using a grinding wheel. The grinding wheel is an abrasive which uses synthetic diamond. Wheel segments (thickness: several millimeters, height: 3 5 mm) are arranged along a ring-shaped wheel base.

DFG8560 Grinders Product Information DISCO Corporation

Inherited grinding specifications with an established reputation. DFG8560 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.

DISCO precision machines dicing-grinding service

Best Equipment for advanced Dicing-Grinding Service. DISCO’s high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.

Dicing and Grinding Using the Disco Corporation

Process Workflow 1: Processing by Each Equipment (Stand-Alone) (Each step is performed by stand-alone equipment) Protective tape (BG tape for backside grinding) is laminated onto the wafer surface’s circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the wafer surface.

Grinding DISCO

In the case of grinding such wafers, measuring thickness by the contact gauge itself makes risk of braking by the contact gauge. Good evaluation of thickness variation between wafers Because NCG measure only the Silicon thickness, it is possible to decrease Silicon thickness variation, caused by the tape differences or the thickness variation

DISCO grinding and polishing machines and abrasive

DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]

Disco Corporation Wikipedia

DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage

DISCO Corporation Company Profile Office Locations

Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines. The Company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation.

Laser Dicing Solutions DISCO Corporation

DBG (Dicing Before Grinding)*1 process is capable of reducing backside chipping by separating the dies during grinding, which also improves die strength. In addition, because the wafer is separated into dies at the end of the grinding process, a reduction in the risk of wafer breakage can be expected during thin grinding.

Accessory Equipment DISCO Corporation

Workpiece charging significantly reduced. The CO 2 Injector lowers the resistivity of purified water by dissolving carbon dioxide gas into the dicing cutting water. Once the user-set resistivity is reached, the CO 2 Injector maintains this level with a high degree of accuracy. By lowering the degree of static charge the workpiece acquires during cutting, the CO 2 Injector helps prevent

Grinding 共通 DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to

Manual Downloads Product Information DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to

Solutions for thinning, dicing and packaging of power

DISCO CONFIDENTIAL only for customer ¤2013 DISCO CORPORATION All rights reserved SiC Grinding by GS08 and Dry Polishing 4 Roughness: much finer than commonly used

DISCO Corporation SEMI

DISCO Corporation. Join Date: Jan 1, 1976. Company ID: 10462. Dicing equipment; grinding equipment and related consumables for materials processing. Primary Industry. Semiconductor, Photonics. Primary Product Category. Equipment and Sub-Systems. Primary Product Sub Category.

GaAs Wafer Thinning with Tape Securing Process Grinding

GaAs is an easily damaged material, so typically wax securing is chosen for grinding due to its strong retaining force. However, if the wheel, processing conditions, tape, and other variables are chosen properly, tape secured grinding is also possible.

Improving TTV by Planarization of DISCO Corporation

Grinding only Planarization of BG tape surface + grinding-Attaching BG tape: BG tape surface becomes uneven: Planarization of the BG tape surface-Grinding: TTV after grinding: Unevenness of the BG tape transferred to the wafer, which deteriorated TTV. Since there is no unevenness in the BG tape, TTV of the wafer after grinding improved.

Disco Corporation Wikipedia

DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage

Grinding DISCO

In the case of grinding such wafers, measuring thickness by the contact gauge itself makes risk of braking by the contact gauge. Good evaluation of thickness variation between wafers Because NCG measure only the Silicon thickness, it is possible to decrease Silicon thickness variation, caused by the tape differences or the thickness variation

DISCO Corporation Company Profile Office Locations

Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines. The Company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation.

Grinding 共通 DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to

Accessory Equipment DISCO Corporation

Workpiece charging significantly reduced. The CO 2 Injector lowers the resistivity of purified water by dissolving carbon dioxide gas into the dicing cutting water. Once the user-set resistivity is reached, the CO 2 Injector maintains this level with a high degree of accuracy. By lowering the degree of static charge the workpiece acquires during cutting, the CO 2 Injector helps prevent

Solutions for thinning, dicing and packaging of power

DISCO CONFIDENTIAL only for customer ¤2013 DISCO CORPORATION All rights reserved SiC Grinding by GS08 and Dry Polishing 4 Roughness: much finer than commonly used

Laser Dicing Solutions DISCO Corporation

DBG (Dicing Before Grinding)*1 process is capable of reducing backside chipping by separating the dies during grinding, which also improves die strength. In addition, because the wafer is separated into dies at the end of the grinding process, a reduction in the risk of wafer breakage can be expected during thin grinding.

SDBG (Stealth Dicing Before Grinding DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. and the modified section is removed during backside grinding. Thus, it is possible to reduce front and backside chipping and produce thin die with a high die strength

Gettering DP Dry Polishing Wheels DISCO Corporation

Due to the ultra-thinning of wafers, loss of gettering performance becomes a major concern. Gettering DP is a new solution which realizes high die strength and good gettering performance at the same time using DISCO’s unique dry polishing process.This chemical-free process has a low environmental impact and polishes thin wafers with a simple process that does not involve using a slurry.

Manual Downloads Product Information DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to

Grinding of Hollow Wafers Grinding Solutions DISCO

Recently, DISCO has received more requests to process hollow wafers for CMOS (complementary metal oxide semiconductor) image sensors and MEMS (micro electro mechanical systems). In order to meet such needs, DISCO is engaged in development of hollow wafer grinding. Here, our

Disco Back Grinding Machines Products & Suppliers

Insaco, Inc. Lens Grinding & Polishing Specialized Lens Generating and Polishing Equipment allows Insaco to Manufacture a wide variety of Lens in Sapphire and other Optical Materials. Since 1947 Insaco has been a precision machining and polishing fabricator of parts from all technical ceramics, sapphire, glass and quartz. We machine these materials to very precise tolerances (many times

DISCO dicing saws and quality equipment dicing-grinding

DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]

DISCO Corp. Nikkei Asia

DISCO Corp. engages in the manufacturing and sale of precision cutting, grinding and polishing machines. It operates through the following business divisions: Precision Machines, Precision